Application Process

iSTEP 2013 Program Application Timeline

 

The application system is now closed and the applications are being reviewed. Thank you to the CMU students who applied for iSTEP 2013.

Feel free to contact us at info@techbridgeworld.org or call +1-412-268-1289 with any questions on this program, our application process, or your application status if you applied for iSTEP 2013.




Selection Criteria

iSTEP (innovating Student Technology ExPerience) is a rigorous and competitive 10-week internship program that requires the involvement of students with high levels of dedication, team work, cross-cultural adaptability, initiative and academic achievement. Students who have participated in iSTEP in past years have exhibited tremendous personal and professional growth as a result of their experiences conducting field research in developing community settings.

 

Eligibility

Requirements


Other Criteria

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Application Procedure

Before applying to this program, consider any personal or academic commitments that will affect your involvement in the summer internship and the spring preparations leading up to the summer program. Take into consideration any constraints related to your research obligations, family commitments, health issues, etc. as you decide whether to apply for this opportunity. See our Current iSTEP page for more details on iSTEP 2013.

To apply for iSTEP 2013, students must do the following by the specified deadlines:

We will select a group of semi-finalists who will participate in an interview process before we make our final selection of the team. Once we have notified students of their selection, they will have 5 business days to commit to our internship offer. We will also notify students if they are a waitlist for the team. Once we have notified waitlisted applicants, they will have 5 business days to commit to our internship offer.

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Interview Policy

If an applicant is late on the day of the interview:

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If you have any questions on any of these details please feel free to contact us.

 

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